Lucintel's latest market report analyzed that 3D IC provides attractive opportunities in the consumer electronics, telecommunication, automotive, military & aerospace, medical device, and industrial markets. The 3D IC market is expected to reach $18.1 billion by 2028 with a CAGR of 25.0%. In this market, stacked 3D is the largest segment by product, whereas consumer electronics is largest...

The global 3D semiconductor packaging market is anticipated to grow at a CAGR of 10.2% during the forecast period (2024-2031). The increasing demand for high-performance computing, artificial intelligence, and innovative computing applications propels the need for semiconductor packaging solutions that deliver high processing power while minimizing power consumption. Semiconductor...

The latest research study ”Advanced Packaging Market: Global Industry Trends, Share, Size, Growth, Opportunity and Forecast 2022-2027” offers a comprehensive analysis of the industry, which comprises insights on global advanced packaging market Share. The global advanced packaging market size reached US$ 32.53 Billion in 2021. Looking forward, IMARC Group expects the market to...

     The global 3D Integrated Circuit (IC) Market size was USD 10.76 Billion in 2021 and is expected to register a revenue CAGR of 21.6% over the forecast period, according to the latest report by Reports and Data. The market is experiencing revenue growth as a result of an increase in demand for smart devices like smartphones and tablets. For smartphones, 3D True IC...

Lucintel's latest market report analyzed that gold bumping provides attractive opportunities in the electronic, industrial, automotive & transport, healthcare, IT & telecommunication, and aerospace & defense applications. The gold bumping market is expected to reach $1.84 billion by 2028 with a CAGR of 5.1%. In this market, 3D IC is the largest segment by product type, whereas...

In order to form Memory Package Substrate Market research report, market analysts do comprehensive market study and points out exact causes of sales decrease as well as reasons behind it. It further helps to decide on the exact problem source and provides ways to deal with it. For making business financially stable, decision making has great significance. In this regard, referring Memory...

A wide range of vital market parameters, including geographical segments, technological spectrum, miscellaneous product types, application landscape, numerous business verticals, sales and distribution channels, and several others, has been included in this report. Our team of researchers has taken a unique approach to analyze the global market and, thus, highlighted the key parameters that...

Lucintel's latest market report analyzed that semiconductor manufacturing equipment provides attractive opportunities in assembly and packaging, dicing, metrology, bonding, and water testing end equipment. The semiconductor manufacturing equipment market is expected to reach $143.9 billion by 2028 with a CAGR of 8.3%. In this market, memory is the largest segment by product type, whereas 3D ICs...

The semiconductor manufacturing equipment market plays a crucial role in the production of integrated circuits and other semiconductor devices. This market encompasses a wide range of equipment used in various stages of the semiconductor manufacturing process, including wafer fabrication, assembly, and packaging. The demand for semiconductor devices continues to grow, driven by advancements in...

Lucintel's latest market report analyzed that solder bumping flip chip provides attractive opportunities in the electronic, industrial, automotive & transport, healthcare, IT & telecommunication, and aerospace and defense applications. The solder bumping flip chip market is expected to reach $3.3 billion by 2028 with a CAGR of 4.5%. In this market, 3D IC is the largest segment by...