Lucintel's latest market report analyzed that gold bumping provides attractive opportunities in the electronic, industrial, automotive & transport, healthcare, IT & telecommunication, and aerospace & defense applications. The gold bumping market is expected to reach $1.84 billion by 2028 with a CAGR of 5.1%. In this market, 3D IC is the largest segment by product type, whereas electronics is largest by application.

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Based on product type, the gold bumping market is segmented into 3D IC, 2.5D IC, and 2D IC. The 3D IC segment accounted for the largest share of the market in 2023 and is expected to register the highest CAGR during the forecast period, due to increasing use of these ICs to deliver performance and energy savings obtained through layering of circuits on top of one another.

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The Gold Bumping Market is marked by the presence of several big and small players. Some of the prominent players offering gold bumping include ASE Group, Amkor Technology, UMC, STATS ChipPAC (JCET Group), and Powertech Technology.

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