Lucintel's latest market report analyzed that solder bumping flip chip provides attractive opportunities in the electronic, industrial, automotive & transport, healthcare, IT & telecommunication, and aerospace and defense applications. The solder bumping flip chip market is expected to reach $3.3 billion by 2028 with a CAGR of 4.5%. In this market, 3D IC is the largest segment by product type, whereas electronics is largest by application.
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Based on product type, the solder bumping flip chip market is segmented into 3D IC, 2.5D IC, and 2D IC. The 3D IC segment accounted for the largest share of the market in 2023 and is expected to register the highest CAGR during the forecast period, due to the increasing use of these ICs in automotive and industrial electrical gadgets.
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The Solder Bumping Flip Chip Market is marked by the presence of several big and small players. Some of the prominent players offering solder bumping flip chip include TSMC, Samsung, ASE Group, Amkor Technology, and UMC.
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