Lucintel's latest market report analyzed that low dielectric resin provides attractive opportunities in the PCB, wire & cable, antenna, microelectronics, and radome applications. The low dielectric resin market is expected to reach $1.4 billion by 2028 with a CAGR of 2.7%. In this market, fluoropolymer is the largest segment by resin type, whereas PCB is largest by application. Increasing...