Global semiconductor & IC packaging market is anticipated to grow at a significant CAGR of 14.9% during the forecast period (2024-2031). The market growth is attributed to the increasing demand of the consumer electronics, growing miniaturization and densification in the electronic sector and adoption of emerging technologies such as 5G and autonomous vehicles. Government support with funds helps various R&D projects and facilitates access to essential semiconductor infrastructure and resources to drive innovation and enhance local talent development. For instance, in June 2023, Micron Technology, Inc. announced plans to build a new semiconductor assembly and test facility in India with an investment of $825.0 million over the two phases of the project. The investment for both phases is up to $2.7 billion under the government's modified assembly, testing, marking, and packaging (ATMP) Scheme.
Increasing semiconductor manufacturing packaging approach provides customers with access to an efficient, localized, and secure supply of semiconductors through a dedicated production facility For instance, In December 2023, Pragmatic Semiconductor announced that it had completed the first close of its Series D funding round, securing an investment of £162.0 million ($201.5 million). The investment enables Pragmatic to accelerate its expansion plans in the UK to meet the growing demand for its unique packaging technology from customers globally.
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• The market number available for – 2023-2031
• Base year- 2023
• Forecast period- 2024-2031
Segment Covered-
• By Technology
• By Packaging Platform
• By End-Users
Regions Covered-
• North America
• Europe
• Asia-Pacific
• Rest of the World
Competitive Landscape- Intel Corp., Micron Technology, Inc., NVIDIA Corp., Renesas Electronics Corp., Taiwan Semiconductor Manufacturing Company Ltd. among others.
Semiconductor & IC Packaging Market Report Segment
By Type
• Organic substrate
• Bonding wires
• Leadframes
• Encapsulation resins
• Ceramic packages
• Die attach materials
• Thermal interface materials
• Solder balls
• Others
By Technology
• Small outline package (SOP)
• Grid array (GA)
• Quad flat no-leads (QFN)
• Dual Flat No-leads (DFN)
• Quad flat packages (QFP)
• Dual-in-line (DIP)
By Packaging Platform
• Flip Chip
• System in a Package (SIP)
• 2.5D/3D
• Embedded Die
• Fan-in Wafer Level Packaging (FI-WLP)
• Fan-out Wafer Level Packaging (FO-WLP)
By End-Users
• Consumer Electronics
• Automotive
• Aerospace & Defence
• IT & Telecommunication
• Healthcare
• Others (Energy and Lighting)
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Semiconductor & IC Packaging Market Report Segment by Region
North America
· United States
· Canada
Europe
· UK
· Germany
· Spain
· France
· Italy
· Rest of Europe
Asia-Pacific
· India
· China
· Japan
· South Korea
· Rest of APAC
Rest of the World
• Latin America
• Middle East and Africa
Company Profiles
• Advanced Micro Devices, Inc.
• Amkor Technology, Inc
• Analog Devices, Inc.
• Applied Materials, Inc.
• ASML Holding N.V (ASML)
• Broadcom Inc.
• Infineon Technologies AG
• Intel Corp.
• Marvell Technology, Inc.
• MediaTek Inc.
• Micron Technology, Inc.
• NXP Semiconductors N.V.
• Qualcomm Technologies, Inc.
• Samsung Electronics Co., Ltd.
• Silicon Laboratories, Inc.
• SK hynix Inc.
• STMicroelectronics N.V.
• Synaptics Inc.
• Texas Instruments Inc.
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