The global 3D semiconductor packaging market is anticipated to grow at a CAGR of 10.2% during the forecast period (2024-2031). The increasing demand for high-performance computing, artificial intelligence, and innovative computing applications propels the need for semiconductor packaging solutions that deliver high processing power while minimizing power consumption. Semiconductor chip packaging is crucial for protecting and connecting semiconductor devices. It shields circuitry from corrosion and physical damage while facilitating electrical connections to the printed circuit board (PCB). Advanced semiconductor packaging techniques, such as 2.5D packaging, 3D packaging, and fan-out packaging, have emerged to meet the demands of modern technology.
Wafer-on-wafer (WoW) advanced packaging technology consists of silicon wafers, or dies, that are stacked vertically rather than placed horizontally across a board. Comprehensive chip-package co-analysis solutions with advanced chip-stacking technology address complex multiphysics challenges in 3D-integrated circuit (IC) packaging technologies. For instance, in October 2023, Ansys launched its latest 3D-IC WoW stacked technology, improving the power, efficiency and performance of edge AI, graphic processing, and wireless communication systems. This empowers more chip designers to employ Ansys’ semiconductor simulation solutions that perform multi-die co-analysis for streamlining and ensuring successful design.
Semiconductor technology roadmaps comprise complex performance requirements that are driving advanced packaging trends, yet present unique package design challenges. For instance, in October 2023, Advanced Semiconductor Engineering, Inc. launched its Integrated Design Ecosystem (IDE), a collaborative design toolset optimized to systematically boost advanced package architecture across its VIPack platform. This innovative approach allows a seamless transition from single-die SoC to multi-die disaggregated IP blocks including chiplets and memory for integration using 3D or advanced fanout structures.
To advance semiconductor device fabrication at the packaging stage by addressing the complexities of shrinking feature sizes, 3D structures and heterogeneous integration. Customers can improve device performance without relying on scaling silicon design nodes. For instance, in September 2021, KLA Corp. launched Kronos 1190 wafer-level packaging inspection system, the ICOS F160XP die sorting and inspection system and the next generation of the ICOS T3/T7 Series of packaged integrated circuit (IC) component inspection and metrology systems.
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• The market number available for – 2023-2031
• Base year- 2023
• Forecast period- 2024-2031
Segment Covered-
• By Technology
• By Material
• By Industry Vertical
Regions Covered-
• North America
• Europe
• Asia-Pacific
• Rest of the World
Competitive Landscape- includes Advanced Micro Devices, Inc., Amkor Technology, Intel Corp., Samsung Electronics Co., Ltd., United Microelectronics Corp. and others.
3D Semiconductor Packaging Market Report Segment
By Technology
• 3D Through silicon via
• 3D Package on Package
• 3D Fan Out Based
• 3D Wire Bonded
By Material
• Organic Substrate
• Bonding Wire
• Leadframe
• Encapsulation Resin
• Ceramic Package
By Industry Vertical
• Electronics
• Industrial
• Automotive & Transport
• Healthcare
• IT & Telecommunication
• Aerospace & Defense
A full Report of 3D Semiconductor Packaging Market is Available @ https://www.omrglobal.com/industry-reports/3d-semiconductor-packaging-market
3D Semiconductor Packaging Market Report Segment by Region
North America
· United States
· Canada
Europe
· UK
· Germany
· Spain
· France
· Italy
· Rest of Europe
Asia-Pacific
· India
· China
· Japan
· South Korea
· Rest of APAC
Rest of the World
• Latin America
• Middle East and Africa
Company Profiles
• Amkor Technology
• Analog Devices, Inc.
• Cadence Design Systems, Inc.
• GlobalFoundries
• Indium Corp.
• Micron Technology, Inc.
• NVIDIA Corp.
• Qualcomm Technologies, Inc.
• Semiconductor Components Industries, LLC
• Siliconware Precision Industries Co., Ltd.
• SK HYNIX INC.
• STMicroelectronics
• Taiwan Semiconductor Manufacturing Company Ltd.
• TEKTRONIX, INC.
• Texas Instruments Inc.
• Thermo Fisher Scientific Inc.
• Tower Semiconductor
• United Microelectronics Corp.
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