Global Advanced IC Substrate Market Overview 2023-2028

IMARC Group, a leading market research company, has recently releases report titled “Advanced IC Substrate Market: Global Industry Trends, Share, Size, Growth, Opportunity and Forecast 2023-2028.” The study provides a detailed analysis of the industry, including the global Advanced IC Substrate market share, size, trends, and growth forecasts. The report also includes competitor and regional analysis and highlights the latest advancements in the market.

The global advanced IC substrate market size reached US$ 9.4 Billion in 2022. Looking forward, IMARC Group expects the market to reach US$ 13.8 Billion by 2028, exhibiting a growth rate (CAGR) of 6.2% during 2023-2028.

An advanced integrated circuit (IC) substrate refers to a specialized electronic component that facilitates the functioning of ICs by providing the necessary electrical connections and structural support. It is compatible with diverse materials, such as silicon, gallium arsenide, and various polymers used in the fabrication of integrated circuits and packaging components. It exhibits excellent electrical conductivity, which ensures efficient signal transmission between the circuits. It possesses exceptional heat dissipation properties, enabling the effective management of temperature fluctuations during operation. It maintains robust dielectric properties and ensures minimal signal interference and reliable performance. It offers mechanical stability and aids in safeguarding against physical stress and environmental factors. It contributes to low transmission losses and supports signal integrity over distances. It helps minimize signal distortion and crosstalk, ensures data accuracy, prevents overheating, and ensures long-term device reliability. Its compact nature aids in space-constrained applications and contributes to lower power consumption and reduced noise interference. Besides this, its thermal management capabilities enhance the lifespan of electronic devices. It is widely used in miniaturized devices, such as smartphones, tablets, and wearables. It is also utilized in vehicle control systems, infotainment, and advanced driver-assistance systems (ADAS). Moreover, it is employed in networking equipment, routers, and communication infrastructure for optimal signal transmission.

Global Advanced IC Substrate Market Trends and Drivers:

The increasing global population and the escalating demand for consumer appliances represent one of the key factors influencing the market positively. Wearable devices rely on compact yet high-performance IC substrates to provide various functionalities while maintaining user comfort. Along with this, the rising demand for smaller and more compact electronic devices is driving the need for advanced IC substrates that can accommodate densely packed circuits with optimal performance. Additionally, the expansion of smart home technologies is driving the demand for IC substrates to enable seamless communication among devices and efficient energy management. Apart from this, the increasing use of sophisticated IC substrates in various techniques like System-in-Package (SiP) and three-dimensional (3D) packaging to enable enhanced integration and performance is offering a favorable market outlook. Moreover, the proliferation of the Internet of Things (IoT) devices is catalyzing the demand for versatile IC substrates to handle diverse applications and connectivity requirements. Furthermore, the rising focus on environmental sustainability is increasing the demand for IC substrates that contribute to energy efficiency and reduce electronic waste. Besides this, the widespread adoption of IC substrates in medical devices that require precise signal transmission, low power consumption, and reliable performance is strengthening the growth of the market.

Global Advanced IC Substrate Market 2023-2028 Analysis and Segmentation:

Top Key Players covered in this report are: ASE Group, AT & S Austria Technologie & Systemtechnik Aktiengesellschaft, Fujitsu Limited, Ibiden Co. Ltd., JCET Group Co. Ltd, Kinsus Interconnect Technology Corp., Korea Circuit Co. Ltd., KYOCERA Corporation, LG Innotek Co. Ltd., Nan Ya PCB Co. Ltd. (Nan Ya Plastics Corporation), TTM Technologies Inc. and Unimicron Technology Corporation (United Microelectronics Corporation).

The report segmented the market on the basis of region, type and application.

Breakup by Type:

  • FC BGA
  • FC CSP

Breakup by Application:

  • Consumer Electronics
  • Automotive and Transportation
  • IT and Telecom
  • Others

Breakup by Region:

  • North America
    • United States
    • Canada
  • Asia-Pacific
    • China
    • Japan
    • India
    • South Korea
    • Australia
    • Indonesia
    • Others
  • Europe
    • Germany
    • France
    • United Kingdom
    • Italy
    • Spain
    • Russia
    • Others
  • Latin America
    • Brazil
    • Mexico
    • Others
  • Middle East and Africa

Key highlights of the report:

  • Market Performance (2017-2022)
  • Market Outlook (2023- 2028)
  • Porter’s Five Forces Analysis
  • Market Drivers and Success Factors
  • SWOT Analysis
  • Value Chain
  • Comprehensive Mapping of the Competitive Landscape

If you need specific information that is not currently within the scope of the report, we can provide it to you as a part of the customization.

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