Lucintel's latest market report analyzed that IC substrate in the global PCB provides attractive opportunities in the tablet PC, smartphone, laptop, and wearable device applications. The IC substrate in the global PCB market is expected to reach $15.3 billion by 2028 with a CAGR of 14.2%. In this market, FC BGA is the largest segment by type, whereas smartphones is largest by application.
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Based on type, the IC substrate in the global PCB market is segmented into FC BGA and FC CSP. The FC BGA segment accounted for the largest share of the market in 2023 and is expected to register the highest CAGR during the forecast period, due to its capability of routing density and ability to be customized for maximum electrical performance.
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The IC Substrate in the Global PCB Market is marked by the presence of several big and small players. Some of the prominent players offering IC substrate in the global PCB include ASE Group, TTM Technologies, Simmtech, Fujitsu Limited, Ibiden, JCET Group Kinsus Interconnect Technology, Korea Circuit, KYOCERA Corporation, and LG Innotek.
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