Lucintel's latest market report analyzed that flip chip technology provides attractive opportunities in the electronic, industrial, automotive & transport, healthcare, IT & telecommunication, and aerospace & defense industries. The flip chip technology market is expected to reach $44.1 billion by 2028 with a CAGR of 5.8%. In this market, copper pillar is the largest segment by bumping technology, whereas electronics is largest by end use industry.

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Based on bumping technology, the flip chip technology market is segmented into copper pillar, solder bumping, tin-lead eutectic solder, lead-free solder, gold bumping, and others. The copper pillar segment accounted for the largest share of the market in 2023 and is expected to register the highest CAGR during the forecast period, due to increasing usage of copper pillar as an interconnector in transceiver, embedded processor, power management, baseband, ASIC, and SOC application.

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The Flip Chip Technology Market is marked by the presence of several big and small players. Some of the prominent players offering flip chip technology include IBM, Intel, Fujitsu, 3M, and Samsung Electronics.

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