Lucintel's latest market report analyzed that printed circuit heat exchanger provides attractive opportunities in the chemical processing, oil & gas, power generation, and industrial applications. The printed circuit heat exchanger market is expected to reach $1.09 billion by 2028 with a CAGR of 4.3%. In this market, steel and stainless steel is the largest segment by material, whereas chemical processing is largest by application.
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Based on material, the printed circuit heat exchanger market is segmented into steel and stainless steel, aluminum, nickel and nickel based alloys, copper, titanium and titanium alloys, and others. The steel and stainless steel segment accounted for the largest share of the market in 2023 and is expected to register the highest CAGR during the forecast period, as it can operate efficiently in both extreme hot and cold temperatures without any damage.
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The Printed Circuit Heat Exchanger Market is marked by the presence of several big and small players. Some of the prominent players offering printed circuit heat exchanger include HEXCES, Alfa Laval, DongHwaEntec,Tanktech, Precision Micro, and VPE Thermal.
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