Lucintel's latest market report analyzed that system in package (SiP) technology provides attractive opportunities in the consumer electronic, automotive, telecommunication, industrial system, and aerospace and defense markets. The system in package (SiP) technology market is expected to reach $40.2 billion by 2028 with a CAGR of 10.2%. In this market, 3D IC packaging is the largest segment by technology, whereas consumer electronics is largest by end use.
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Based on technology, the system in package (SiP) technology market is segmented into 2D IC packaging, 2.5D IC packaging, and 3D IC packaging. The 3D IC packaging segment accounted for the largest share of the market in 2023 and is expected to register the highest CAGR during the forecast period, because it delivers improved performance compared to other technologies.
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The System in Package (Sip) Technology Market is marked by the presence of several big and small players. Some of the prominent players offering system in package (SiP) technology include Jiangsu Changjiang Electronics Technology, Chipmos Technologies, Powertech Technologies, ASE Group, Amkor Technology, and Fujitsu.
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