The global market size for Embedded Die in Substrate (Panel‐Level) Packaging market was USD 77.84 Billion in 2022 and is projected to grow at a revenue CAGR of 22% during the forecast period. The market growth is driven by the increasing demand for small and effective electronic devices due to the rise in high-performance computing and revenue growth of the Internet of Things (IoT) market. The trend towards miniaturization and the popularity of wearable technology are also contributing to the revenue growth of the market. The integration of various components onto a single substrate using embedded die packaging technology leads to smaller overall footprints and improved performance.
The major factors driving revenue growth of the market are high demand for high-performance computing and the rapidly growing IoT market. As the demand for high-performance computing rises, the trend towards the development of new and sophisticated packaging technologies that enable more efficient and compact electronic devices is expected to continue over the next few years. Compact and effective electronic devices that can communicate with each other are becoming more necessary as the number of connected devices increases.
However, the high implementation cost and complexity of the technology could restrain revenue growth of the market. Embedded die packaging requires specialized tools and technology, which can be expensive to implement, and may pose a challenge for small and medium-sized businesses (SMEs) to invest in. Moreover, technical difficulties such as heat dissipation, dependability, and compatibility with other technologies may lead to reduced performance and higher costs, which could hamper revenue growth of the market.
The global Embedded Die in Substrate (Panel‐Level) Packaging market is segmented based on technology outlook and end-user outlook. The 3D packaging segment is expected to account for the largest revenue share during the forecast period due to its advantages over conventional packaging. The OEMs segment is expected to account for the largest revenue share among end-users during the forecast period.
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Embedded Die Packaging Technology Market: Notable Innovation
Embedded Die in Substrate (Panel‐Level) Packaging has seen several notable innovations in recent years. One of the most significant is the development of fan-out wafer-level packaging (FOWLP), which allows for more efficient use of space within the package. FOWLP involves the redistribution of the connections from the edge of the chip to an array of solder balls on the surface of the package. This approach allows for greater flexibility in the placement of components and can lead to smaller form factors and higher-density packages.
Another important innovation is the use of through-silicon vias (TSVs) to interconnect multiple die within a package. TSVs are vertical electrical connections that pass through the silicon substrate of the chip, allowing for more efficient communication between the different die. This approach enables the integration of multiple functions within a single package, reducing the need for multiple chips and improving performance.
Finally, the development of wafer-level chip-scale packaging (WLCSP) has also been an important innovation in embedded die packaging technology. WLCSP involves the mounting of the chip directly onto the substrate, with no external leads or connections. This approach results in a very small form factor and can be used for applications such as mobile devices and wearables.
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