Lucintel's latest market report analyzed that semiconductor packaging provides attractive opportunities in the consumer electronics, automotive, healthcare, IT & telecommunication, and aerospace & defense end use industries. The semiconductor packaging market is expected to reach $29.2 billion by 2028 with a CAGR of 9.0. In this market, flip chip is the largest segment by type, whereas consumer electronics is largest by technology.
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Based on type, the semiconductor packaging market is segmented into flip chip, embedded die, fan-in WLP, and fan-out WLP. The flip chip segment accounted for the largest share of the market in 2023 and is expected to register the highest CAGR during the forecast period, due to growing demand for advanced high-performance in electronics for retail and commercial application and increasing penetration of electronic devices globally.
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The Semiconductor Packaging Market is marked by the presence of several big and small players. Some of the prominent players offering semiconductor packaging include Amkor Technology, ASE Technology Holding Co., Siliconware Precision Industries Co., SÜSS MICROTEC SE, Jiangsu Changjiang Electronics Tech Co, IBM, Intel Corporation, Qualcomm Technologies, STMicroelectronics, 3M, and Cisco Systems.
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